Automated Laser Surface Profiler for Packaging Material
Prototyped and developed a complete hardware platform for the automated profile of cardboard packaging material, funded by TetraPak International Company. The platform consists of a Laser Sensor (SICK-) sensor which can scan the cardboard surface with 2 micrometer accuracy, showing a 2D profile. The hardware was developed over ATMEGA328p micro-controller running the GRBL firmware for driving the XY-System of the profiler. The drivers for the Laser Sensor were developed in Python and a Software application for the analysis and visualization of the results was implemented in MATLAB. The MATLAB application performs sophisticated signal processing and mathematical modelling to develop a model of the deformations on the cardboard material.
Über Mich
I offer professional services in these broad domains -> Embedded Systems: -Complete system level design to schematic and PCB designing. Experienced in ARM platforms (STM32F4xx, TIVA C Series, Infineon XMC4500), ATMEL, PIC, Arduino (Mega, Uno, Nano, Pro-Mini, Standalone) and FPGAs (Spartan-3, BASYS-2). -Experienced in USART, I2C, SPI, CAN, Ethernet, OBD-2 and USB protocols. -Projects completed using all types of sensors (Gas, Air Quality, IMUs, Sonars, Infrared and many more) and modules (Xigbee, ESP32, Bluetooth, nRF24L01+). -> PCB -2 year professional experience of multi-layer (2 to 8 layers) PCB development. Experienced in Altium, Cadence, Proteus and Eagle. -> ML, AI and Computer Vision -Development experience in Python/Anaconda, Scikit, OpenCV, Tensorflow, Keras, dlib, Deep Neural Networks, Haar-cascade classifiers, WEKA, Feature Extraction/Selection, PCA, LDA and theoretical Machine Learning.
$10 USD/Std
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